Flip Chip Technology Market 2018: Global Trends, Sales Revenue, Comprehensive Analysis, Emerging Opportunities, Business Growth, Top Leaders and Industry Expansion Strategies 2023

Market Research Future published a research report on “Flip Chip Technology Market Report- Forecast till 2023” – Market Analysis, Scope, Stake, Progress, Trends and Forecast to 2023.

Pune, India - November 14, 2018 /MarketersMedia/ —

Market Overview:

Integrated circuit (IC) packaging has been revolutionized with advents made in flip chip technology. Introduced by IBM Corporation in 1960, this component has been transforming the face of consumer electronic devices ever since. The semiconductor device is designed to incorporate solder bumps over the connection pads of the IC or micro-electromechanical system (MEMS). Subsequently, it creates a reliable connection between the component and the board and this flip chip technology is finding its popularity amidst mainframe computers, personal computers, servers, notebooks, smartphones, tablets, and in other devices. Its features such as low power cost and high-density packaging are helping flip chip technology in gaining traction. The global flip chip technology market is expecting a substantial 8.29% CAGR to scale new heights during the forecast period (2017-2023). Market Research Future’s (MRFR) detailed study includes drivers that would impact crucially in the flip chip technology market growth and segments for a better understanding of the current market scenario.

Get Sample of Report @ https://www.marketresearchfuture.com/sample_request/5381

However, its cost is still a challenge. The cost stems from wafer fabrication vendors, substrate vendors, and assembly/packaging subcontractors and it only increases with added assembling cost. But its pivotal role in consumer electronic devices can steer it out of future complication and ensure smooth market flow.

Key Players

Some of the major players in Flip Chip Technology Market are Samsung Group (South Korea), Intel Corporation (U.S.), Global Foundries (U.S.), UMC (Taiwan), ASE, Inc. (Taiwan), Amkor Technology (U.S.), STATS ChipPAC (Singapore), Powertech Technology (Taiwan), and STMicroelectronics (Switzerland), Texas Instruments (U.S.) among others.

Segmentation:

The global flip chip technology market is segmented on the basis of wafer bumping process, packaging technology, packaging type, product, application, and region. On the basis of the wafer bumping process, the segment is further classified into copper (CU) pillar, lead-free, Tin-lead eutectic solder and gold stud plated solder. On the basis of the packaging technology, the market is further classified into 2D, 2.5D, and 3D packaging technology. On the basis of the packaging type, the market is further classified into FC BGA (Flip Chip Ball Grid Array), FC PGA (Flip Chip Pin Grid Array), FC LGA (Flip Chip Land Grid Array), FC QFN (Flip Chip Quad Flat No-Lead), FC SIP (Flip Chip System-In-Package), and FC CSP (Flip Chip-Chip-Scale Package). On the basis of the product the segment is further classified into LED, CMOS image sensor, CPU, RF, Analog, Mixed Signal, and Power IC, SoC and others. Flip chip technology is widely used in many areas such as consumer electronics, automotive, telecommunications, industrial, medical devices, military and aerospace and others.

The global flip chip technology market is estimated to grow at 8.29% CAGR through the forecast period.

Regional Analysis

The flip chip technology market in Asia Pacific region is expected to grow at the highest CAGR over the forecast period. With the rising technological innovation, competition and M&A activities in the industry, many local and regional vendors are offering specific application products to varied end-users, which make the Asia Pacific market a global leader in flip chip technology. The advantages of using flip chip technology in navy and consumer electronics industry have encouraged to adopt this flip chip technology in North America.

Industry Trend:

Tokyo Denkikagaku Kōgyō Corporation (TDK) recently showcased the upgraded model of AFM GGI flip chip model which features new horn designs to provide linear X-Y nozzle movement for die sizes up to 10mm2. This will increase its performance and bring-in a lead-free process.

Kulicke & Soffa Industries announced the launch of Katalyst that boasts of leading-edge technology to provide high accuracy flip chip bonder. Its advanced capabilities ensure better performance in automated ground vehicles (AGV).

Get complete Report @ https://www.marketresearchfuture.com/reports/flip-chip-technology-market-5381

Intended Audience

• Wafer manufacturers
• Raw material and manufacturing equipment suppliers
• Chip manufacturers
• System integrators
• Device manufacturers
• Foundry players
• Distributors and retailers
• Research organizations

About Us:

At Market Research Future (MRFR), we enable our customers to unravel the complexity of various industries through our Cooked Research Report (CRR), Half-Cooked Research Reports (HCRR), Raw Research Reports (3R), Continuous-Feed Research (CFR), and Market Research & Consulting Services.

MRFR team have supreme objective to provide the optimum quality market research and intelligence services to our clients. Our market research studies by products, services, technologies, applications, end users, and market players for global, regional, and country level market segments, enable our clients to see more, know more, and do more, which help to answer all their most important questions.

In order to stay updated with technology and work process of the industry, MRFR often plans & conducts meet with the industry experts and industrial visits for its research analyst members.

Contact Info:
Name: Abhishek Sawant
Organization: Market Research Future

Source URL: https://marketersmedia.com/flip-chip-technology-market-2018-global-trends-sales-revenue-comprehensive-analysis-emerging-opportunities-business-growth-top-leaders-and-industry-expansion-strategies-2023/443107

For more information, please visit https://www.marketresearchfuture.com

Source: MarketersMedia

Release ID: 443107